发明授权
- 专利标题: Soldering materials dispensing apparatus
- 专利标题(中): 焊接材料分配装置
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申请号: US31999073申请日: 1973-01-02
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公开(公告)号: US3815843A公开(公告)日: 1974-06-11
- 发明人: FORTUNE W
- 申请人: FORTUNE WILLIAM S
- 专利权人: Fortune William S
- 当前专利权人: Fortune William S
- 优先权: US31999073 1973-01-02
- 主分类号: B23K3/06
- IPC分类号: B23K3/06 ; B65H75/16 ; B65H75/40 ; B65H49/18
摘要:
A molded, hand held dispenser for solder or other strand materials. The apparatus carries a plurality of replaceable, bobbin spools in a bobbin case body portion. A dispensing extension formed integrally therewith is provided with internal, strand guide means for dispensing the soldering materials through a snout portion of the extension. A molded cover plate for the dispensing extension portion is provided and includes retaining clip means for securing the ends of the strand materials when not in use. Similarly, a molded cover for the bobbin case portion is provided having an integral spindle for the bobbin spools.
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