Invention Grant
- Patent Title: Carrier for microcircuit packages
- Patent Title (中): 承载微电路封装
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Application No.: US42020973Application Date: 1973-11-29
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Publication No.: US3893742APublication Date: 1975-07-08
- Inventor: BLANCHARD KENNETH E , HOOK KENNETH R , MIDILI ARTHUR R
- Applicant: WELLS ELECTRONICS
- Assignee: Wells Electronics
- Current Assignee: Wells Electronics
- Priority: US42020973 1973-11-29
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K7/10 ; H01R13/60
Abstract:
A carrier for microcircuit packages in which the packages are releasably interlocked within the carrier by a snap-fitting arrangement.
Information query
