公开(公告)号：US3893742A

公开(公告)日：1975-07-08

申请号：US42020973

申请日：1973-11-29

Applicant: WELLS ELECTRONICS

Inventor： BLANCHARD KENNETH E ,  HOOK KENNETH R ,  MIDILI ARTHUR R

IPC: H05K3/30 ,  H05K7/10 ,  H01R13/60

CPC classification number: H05K7/1076 ,  H05K3/301 ,  H05K2201/10606

Abstract: A carrier for microcircuit packages in which the packages are releasably interlocked within the carrier by a snap-fitting arrangement.

Abstract translation: 用于微电路封装的载体，其中所述封装通过卡扣装置可释放地联锁在所述载体内。

公开(公告)号：US3874022A

公开(公告)日：1975-04-01

申请号：US34274073

申请日：1973-03-19

Applicant: WELLS ELECTRONICS

Inventor： WOGOMAN FRANK W ,  SMELTZER PAUL W

IPC: A47L7/00 ,  B41F35/00 ,  D06F43/00

CPC classification number: A47L7/0047 ,  A47L7/00 ,  B41F35/005 ,  B41P2235/31 ,  D06F43/002

Abstract: Ink is removed from the screen utilized in a silk screen printing process by positioning a cleaning head having first and second orifices over the screen. A vacuum is drawn at one of the orifices of the cleaning head and causes the cleaning solvent to be withdrawn from the other orifice across the cleaning head in contact with the screen, thus causing ink particles to be removed from the screen and transported in the solvent to a depository.

Abstract translation: 通过将具有第一和第二孔的清洁头定位在筛网上，从丝网印刷过程中使用的筛网中除去油墨。 在清洁头的一个孔处抽真空，并使清洁溶剂从与筛网接触的清洁头上的另一个孔中取出，从而使油墨颗粒从筛网中移出并在溶剂中运输 到保管处。

公开(公告)号：US3248638A

公开(公告)日：1966-04-26

申请号：US22000362

申请日：1962-08-28

Applicant: WELLS ELECTRONICS

Inventor： MUELLER ANDREW A

IPC: B23K11/26

CPC classification number: B23K11/26

公开(公告)号：US3650450A

公开(公告)日：1972-03-21

申请号：US3650450D

申请日：1969-11-24

Applicant: WELLS ELECTRONICS

Inventor： LARSON RAYMOND B ,  WOGOMAN FRANK W

IPC: B23K3/00 ,  B23K3/047 ,  H01L21/00 ,  H05K1/00 ,  H05K3/34 ,  B23K1/00 ,  B23K5/22

CPC classification number: H01L21/67138 ,  B23K3/00 ,  B23K3/047 ,  B23K2201/32 ,  H01L24/45 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/45014 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/45155 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01075 ,  H05K1/0393 ,  H05K3/341 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2203/0195 ,  Y02P70/613 ,  H01L2224/45015 ,  H01L2924/20751 ,  H01L2924/20752

Abstract: A method and means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly. The electrical assembly is mounted upon a shiftable support means. A shiftable soldering assembly is positioned above the support means and carries an intermediate part of the elongated conductor. The soldering assembly and support means are shifted relative to each other to cause the intermediate conductor part to be held against a selected conductive element. The intermediate conductor part is then heated to cause the stripping or melting of the insulation, if any, from the conductor part and the melting of the solder on the conductive element in contact with the conductor part. The conductor part is then cooled to permit the melted solder to adheringly solidify to the conductor part. With the conductor part so anchored to the electrical assembly the soldering assembly and support means are shifted relative to each other to cause another intermediate part of the conductor to be held against another selected conductive element. This last mentioned intermediate conductor part is heated and cooled to cause its adherence to the contacting conductive element in the manner previously described for heating and cooling the first mentioned intermediate conductor part.

Abstract translation: 一种用于在细长导体的中间部分和电气组件上的选定导电元件之间形成电接头的方法和装置。 电气组件安装在可移动的支撑装置上。 可移动焊接组件位于支撑装置上方，并承载细长导体的中间部分。 焊接组件和支撑装置相对于彼此移动，以使中间导体部分保持抵靠选定的导电元件。 然后将中间导体部分加热，以使绝缘体（如果有的话）从导体部分剥离或熔化，并导致与导体部分接触的导电元件上的焊料熔化。 然后将导体部分冷却以允许熔化的焊料粘附到导体部分上。 由于导体部分固定到电气组件上，焊接组件和支撑装置相对于彼此移动，以使导体的另一个中间部分保持抵靠另一个选定的导电元件。 该最后提到的中间导体部分被加热和冷却，以使其以前述用于加热和冷却第一中间导体部分的方式粘附于接触导电元件。

公开(公告)号：US3127501A

公开(公告)日：1964-03-31

申请号：US19062262

申请日：1962-04-27

Applicant: WELLS ELECTRONICS

Inventor： AUGUST MUELLER ANDREW

IPC: B23K11/31

CPC classification number: B23K11/318

公开(公告)号：US3812581A

公开(公告)日：1974-05-28

申请号：US19552071

申请日：1971-11-03

Applicant: WELLS ELECTRONICS

Inventor： LARSON R ,  WOGOMAN F

IPC: H01L21/00 ,  H05K3/34 ,  H01R43/00

CPC classification number: H01L21/67138 ,  H05K3/341 ,  H05K3/3494 ,  H05K2203/0195 ,  Y10T29/49162 ,  Y10T29/49169

Abstract: A method and means for forming electrical joints between intermediate parts of an elongated conductor and selected conductive elements on an electrical assembly. The electrical assembly is mounted upon a shiftable support means. A shiftable soldering assembly is positioned above the support means and carries an intermediate part of the elongated conductor. The soldering assembly and support means are shifted relative to each other to cause the intermediate conductor part to be held against a selected conductive element. The intermediate conductor part is then heated to cause the stripping or melting of the insulation, if any, from the conductor part and the melting of the solder on the conductive element in contact with the conductor part. The conductor part is then cooled to permit the melted solder to adheringly solidify to the conductor part. With the conductor part so anchored to the electrical assembly the soldering assembly and support means are shifted relative to each other to cause another intermediate part of the conductor to be held against another selected conductive element. This last mentioned intermediate conductor part is heated and cooled to cause its adherence to the contacting conductive element in the manner previously described for heating and cooling the first mentioned intermediate conductor part.

Abstract translation: 一种用于在细长导体的中间部分和电气组件上的选定导电元件之间形成电接头的方法和装置。 电气组件安装在可移动的支撑装置上。 可移动焊接组件位于支撑装置上方，并承载细长导体的中间部分。 焊接组件和支撑装置相对于彼此移动，以使中间导体部分保持抵靠选定的导电元件。 然后将中间导体部分加热，以使绝缘体（如果有的话）从导体部分剥离或熔化，并导致与导体部分接触的导电元件上的焊料熔化。 然后将导体部分冷却以允许熔化的焊料粘附到导体部分上。 由于导体部分固定到电气组件上，焊接组件和支撑装置相对于彼此移动，以使导体的另一个中间部分保持抵靠另一个选定的导电元件。 该最后提到的中间导体部分被加热和冷却，以使其以前述用于加热和冷却第一中间导体部分的方式粘附于接触导电元件。