Apparatus for checking a structural component for inherent stresses includes strain gage means for attachment to a surface measuring area of the component, the strain gage means having terminals for leads, means for cutting an annular groove into the component around the area, electrical response measuring means remote from the area, and leads extending from the terminals of the strain gage means to the electrical response measuring means for measuring the change in electrical response of the strain gage means due to the cutting of successive layers of material out of the groove, as indicative of the inherent stress existing prior thereto, the cutting means includes a crown boring tool for machining the annular groove around the measuring area, the crown boring tool having a shaft hollow throughout and being mounted in a hollow boring spindle, the terminal leads of the strain gage means attached to the measuring area extending through the crown boring tool and the hollow boring spindle. The apparatus further includes a base plate, the strain gage means being a plurality of strain gage strips mounted on the plate, each of the strips having two of the terminal leads, one of the terminal leads of each of the plurality of strain gage strips being connected to a common connecting spot on the base plate, and each of the other terminal leads of the plurality of strain gage strips being respectively connected to separate connecting spots on the base plate; cover plate means superposed on the base plate above the strain gage strips and the terminal leads and formed with openings overlying the connecting spots, the solder deposits respectively extending through the openings and connected with and fixing the position of the terminal leads, the solder deposits simultaneously serving as solder support spots connectible to exterior connecting lines leading to a measuring instrument.