The invention relates to storage-stable, quick-curing epoxide resin moulding materials containing:A. epoxide resins,B. pre-adducts containing free amino groups and formed from polyamines containing aromatic groups and low-molecular epoxide resins, as curing agents, andC. mineral or organic pulverulent or fibrous fillers, with the epoxide resins and the curing agents softening between 45.degree. and 120.degree. C, and having a melting point higher by 5.degree. to 30.degree. C than the softening point, and being present in the said moulding materials predominantly in the form of particles separated from each other. The moulded articles have good mechanical and dielectrical properties.