A process for chemical plating of nickel or cobalt onto materials otherwise noncatalytic to the plating baths by pretreating the materials with a reducing agent such as sodium borohydride or dimethylamine borane prior to chemical plating. Treating the material with an oxidizing agent prior to the pretreatment is also useful, especially for plating copper. The invention is particularly desirable for plating nickel onto copper conductor patterns on polymeric substrate circuit boards. The copper is plated with nickel, and the substrate is not.