New and improved copper base alloys, characterized by a combination of high electrical conductivity and excellent strength properties, consisting essentially of 0.8 - 5% by weight of titanium, a portion of which may be a like element such as zirconium or hafnium or both, 1.2 - 5% by weight of antimony, part of which may be replaced by one or more of the elements arsenic, phosphorus, silicon, germanium and tin, with the atomic ratio of the total titanium, and like elements, to antimony, and like elements, being 5:3 or somewhat less, and the balance essentially copper. The desired properties are attained by the proper application of mechanical processing steps and thermal treatments.