Invention Grant
- Patent Title: Process for fabricating a heat exchanger
- Patent Title (中): 制造热交换器的方法
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Application No.: US672200Application Date: 1976-03-31
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Publication No.: US4054239APublication Date: 1977-10-18
- Inventor: James J. Watson, Jr.
- Applicant: James J. Watson, Jr.
- Applicant Address: NY Syracuse
- Assignee: Carrier Corporation
- Current Assignee: Carrier Corporation
- Current Assignee Address: NY Syracuse
- Main IPC: B23K31/02
- IPC: B23K31/02 ; B23K1/00 ; B23K1/08 ; F28F9/26 ; B21D53/02
Abstract:
An ultrasonic dip soldering process for bonding the tubular joints of a heat exchanger made up of tubular components joined together to form flow circuits within a fan coil. The joints are positioned adjacent to one of the tube sheets of the fan coil structure and the joints preheated by means of a remote heating process. The joints are then immersed in a molten bath of solder and treated to ultrasonic energy while in the bath.
Public/Granted literature
- US4622194A Process for forming concrete machine tools Public/Granted day:1986-11-11
Information query
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