A method of making a multi-circuit electrical interconnector comprises the molding of an elastomeric, non-conductive frame member having a number of openings extending therethrough corresponding to the number of circuits that are to be interconnected. Each of the openings is overfilled with a module of uncured, heat curable elastomeric resin containing a plurality of electrically conductive particles. All of the modules are subjected to compression and the modules are cured while maintaining them under compression. All of the cured modules are exercised and stabilized physically and electrically by subjecting them to successive applications of compressive force.