发明授权
- 专利标题: Method of making a multi-circuit electrical interconnector
- 专利标题(中): 制造多回路电气互连器的方法
-
申请号: US669998申请日: 1976-03-24
-
公开(公告)号: US4067945A公开(公告)日: 1978-01-10
- 发明人: Gideon A. DuRocher
- 申请人: Gideon A. DuRocher
- 申请人地址: IN Fort Wayne
- 专利权人: Essex International, Inc.
- 当前专利权人: Essex International, Inc.
- 当前专利权人地址: IN Fort Wayne
- 主分类号: H01R11/01
- IPC分类号: H01R11/01 ; G04G17/06 ; H01R13/24 ; H01R43/00 ; H05K3/40 ; H01H3/00
摘要:
A method of making a multi-circuit electrical interconnector comprises the molding of an elastomeric, non-conductive frame member having a number of openings extending therethrough corresponding to the number of circuits that are to be interconnected. Each of the openings is overfilled with a module of uncured, heat curable elastomeric resin containing a plurality of electrically conductive particles. All of the modules are subjected to compression and the modules are cured while maintaining them under compression. All of the cured modules are exercised and stabilized physically and electrically by subjecting them to successive applications of compressive force.
公开/授权文献
- US5770294A Molded glass plates produced by mold with modified surface 公开/授权日:1998-06-23