发明授权
US4075066A Electroplating zinc, ammonia-free acid zinc plating bath therefor and additive composition therefor 失效
电镀锌,无氨酸锌电镀浴及其添加剂组成

Electroplating zinc, ammonia-free acid zinc plating bath therefor and
additive composition therefor
摘要:
The present invention provides an ammonia-free acid zinc plating bath for electrodepositing bright zinc on a substrate in which the zinc deposit produced thereby is ductile and presents a glossy to bright coating on the substrate over a wide cathodic current density range. The ammonia-free acid zinc plating baths of the invention comprise zinc ions, chloride ions, at least one polyoxyalkylated naphthol, at least one aromatic carboxylic acid or bath-soluble salt thereof, and at least one anionic aromatic sulfonic acid or bath-soluble salt thereof. In addition to the above components, the ammonia-free acid zinc plating baths of the invention may contain at least one nonionic polyoxyethylene compound and at least one aromatic aldehyde, ketone, or mixtures thereof. The ammonia-free acid zinc plating baths of the invention are free from significant amounts of complexing agents that would impede the removal of zinc ions from the baths prior to disposal.
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