Acid zinc plating baths, compositions useful therein, and methods for
electrodepositing bright zinc deposits
    3.
    发明授权
    Acid zinc plating baths, compositions useful therein, and methods for electrodepositing bright zinc deposits 失效
    酸性镀锌浴,其中使用的组合物以及电沉积亮锌沉积物的方法

    公开(公告)号:US4169772A

    公开(公告)日:1979-10-02

    申请号:US958124

    申请日:1978-11-06

    IPC分类号: C25D3/22

    CPC分类号: C25D3/22

    摘要: An aqueous acidic plating bath for the electrodeposition of a bright zinc deposit on a substrate is disclosed and comprises zinc ions and an amount, sufficient to provide a level and bright deposit, of at least one bath-soluble composition obtained by the reaction of a nitrogen-containing heterocyclic compound with formaldehyde, an epihalohydrin or glycerol halohydrin and at least one amino compound selected from the group consisting of (i) ammonia, (ii) an aliphatic amine, or (iii) an amidine. Additionally, the plating baths of the invention may contain a nitrogen-containing compound obtained by the reaction of ammonia, an aliphatic amine containing at least one primary amine group, or mixtures thereof with one or more epihalohydrins, glycerol halohydrins or mixtures thereof. Thioureas and anionic aromatic sulfonic acids or salts thereof also are contemplated as being useful in the plating baths of the invention. Methods for depositing a bright zinc coating over a wide range of current densities also are described.

    摘要翻译: 公开了一种用于在基底上电沉积光亮锌沉积物的酸性电镀液,其包含锌离子和足以提供水平和光亮沉积物的至少一种通过氮气反应获得的溶液组合物的量 (i)氨,(ii)脂族胺,或(iii)脒等)中选择的至少一种氨基化合物,所述化合物与甲醛,表卤代醇或甘油卤代醇和至少一种氨基化合物。 此外,本发明的电镀液可以含有通过氨反应得到的含氮化合物,含有至少一个伯胺基团的脂族胺或其混合物与一种或多种表卤代醇,甘油卤代醇或其混合物。 硫脲和阴离子芳族磺酸或其盐也被认为可用于本发明的电镀浴。 还描述了在宽电流密度范围内沉积亮锌涂层的方法。

    Acid zinc plating baths and methods for electrodepositing bright zinc
deposits
    5.
    发明授权
    Acid zinc plating baths and methods for electrodepositing bright zinc deposits 失效
    酸性锌电镀浴和电沉积亮锌沉积物的方法

    公开(公告)号:US4162947A

    公开(公告)日:1979-07-31

    申请号:US908567

    申请日:1978-05-22

    IPC分类号: C25D3/22

    CPC分类号: C25D3/22

    摘要: An aqueous acidic plating bath for the electrodeposition of a bright zinc deposit on a substrate is disclosed and comprises zinc ions, ammonium ions and at least one aromatic sulfonic acid or salt having the general formula ##STR1## wherein R.sub.1, R.sub.2 and R.sub.3 are each independently hydrogen or lower alkyl groups,X is hydrogen, ammonia or any metal with the proviso that the metal sulfonate is soluble in the bath, andA is a saturated, unsaturated or aromatic ring.Additionally, the plating baths of the invention may contain aromatic carbonyl-containing compounds and particularly aromatic aldehydes containing at least one halogen substituent. Polyoxyalkylated naphthols and polyalkylene glycol ethers as well as poly(alkyleneimines) also are contemplated as being useful in the plating baths of the invention. Methods for depositing a bright zinc coating over a wide range of current densities, and additive compositions for preparing plating baths useful in these methods also are described.

    摘要翻译: 公开了一种用于在基底上电沉积明亮的锌沉积物的酸性电镀浴,其包含锌离子,铵离子和至少一种具有通式为“I”或“II”的芳香族磺​​酸或盐,其中R1, R2和R3各自独立地为氢或低级烷基,X为氢,氨或任何金属,条件是金属磺酸盐可溶于浴中,A为饱和的,不饱和的或芳香环。

    Bath and method for electroplating tin and/or lead
    8.
    发明授权
    Bath and method for electroplating tin and/or lead 失效
    用于电镀锡和/或铅的浴和方法

    公开(公告)号:US4135991A

    公开(公告)日:1979-01-23

    申请号:US824043

    申请日:1977-08-12

    IPC分类号: C25D3/32 C25D3/36 C25D3/60

    CPC分类号: C25D3/36 C25D3/32 C25D3/60

    摘要: An aqueous acid plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described and comprises at least one metal salt selected from the group consisting of a stannous salt, a lead salt or a mixture of stannous and lead salts, and as a brightener agent, an effective amount of at least one alkoxylated amine of the formula ##STR1## wherein R is a fatty acid alkyl group containing from about 8 to about 22 carbon atoms,R.sup.1 is an alkylene radical containing up to about 5 carbon atoms,R.sup.2 and R.sup.3 are each independently an ethylene or propylene group,A is 0 or 1, andX, y and z are each independently integers from 1 to about 30, and the sum of x, y, and z is an integer of from about 2 to about 50.Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths as well as additive compositions for forming the baths also are described.

    Nitrogen and sulfur compositions and acid copper plating baths
    9.
    发明授权
    Nitrogen and sulfur compositions and acid copper plating baths 失效
    氮和硫组成和酸性镀铜浴

    公开(公告)号:US4134803A

    公开(公告)日:1979-01-16

    申请号:US862940

    申请日:1977-12-21

    CPC分类号: C25D3/38

    摘要: Nitrogen and sulfur compositions are described which are useful in aqueous acidic plating baths and processes for electrodepositing bright and level copper coatings. The compositions are prepared by reacting a mixture of(a) a disulfide having the formula[RR'NCS.sub.2 ].sub.2 (Formula I)wherein R and R' are each independently hydrogen, alkyl or aryl groups, and(b) a halo hydroxy sulfonic acid having the formulaX(CH.sub.2).sub.n CHOH--CH.sub.2 SO.sub.3 M (Formula II)wherein X is a halogen, n is one or two and M is hydrogen or an alkali metal, in(c) an aqueous alkaline medium.Particularly bright and level deposits are obtained when the reaction mixture used to form the composition also contains an aliphatic aldehyde containing up to three carbon atoms. The presence of the above-described brightening and leveling agents in acid copper plating baths produces a lustrous, smooth and level deposit of copper over a wide range of current densities, particularly when wetting agents are included in the plating baths.

    摘要翻译: 描述了在含水酸性电镀浴中有用的氮和硫组合物以及用于电沉积光亮和水平铜涂层的方法。 通过使(A)具有式[R'NCS2] 2的式(A)的混合物(其中R和R'各自独立地为氢,烷基或芳基)和(B)A HALO羟基磺酸 具有式(C)AN AQUEOUS ALKALINE MEDIUM的式X(CH 2)n CHOH-CH 2 SO 3 M(式II)其中X是卤素,n是一个或两个,M是氢或碱金属。

    Electroplating zinc, ammonia-free acid zinc plating bath therefor and
additive composition therefor
    10.
    发明授权
    Electroplating zinc, ammonia-free acid zinc plating bath therefor and additive composition therefor 失效
    电镀锌,无氨酸锌电镀浴及其添加剂组成

    公开(公告)号:US4075066A

    公开(公告)日:1978-02-21

    申请号:US762883

    申请日:1977-01-27

    IPC分类号: C25D3/22

    CPC分类号: C25D3/22

    摘要: The present invention provides an ammonia-free acid zinc plating bath for electrodepositing bright zinc on a substrate in which the zinc deposit produced thereby is ductile and presents a glossy to bright coating on the substrate over a wide cathodic current density range. The ammonia-free acid zinc plating baths of the invention comprise zinc ions, chloride ions, at least one polyoxyalkylated naphthol, at least one aromatic carboxylic acid or bath-soluble salt thereof, and at least one anionic aromatic sulfonic acid or bath-soluble salt thereof. In addition to the above components, the ammonia-free acid zinc plating baths of the invention may contain at least one nonionic polyoxyethylene compound and at least one aromatic aldehyde, ketone, or mixtures thereof. The ammonia-free acid zinc plating baths of the invention are free from significant amounts of complexing agents that would impede the removal of zinc ions from the baths prior to disposal.

    摘要翻译: 本发明提供了一种用于在其上由此生产的锌沉积物延展性并且在宽的阴极电流密度范围上在基板上呈现光泽的光泽涂层的基板上电沉积亮锌的无氨酸锌电镀浴。 本发明的无氨酸锌电镀液包含锌离子,氯离子,至少一种聚氧化烷基化萘酚,至少一种芳族羧酸或其可溶于浴的盐,以及至少一种阴离子芳香族磺酸或浴溶性盐 其中。 除了上述成分之外,本发明的无氨酸锌电镀液可以含有至少一种非离子聚氧乙烯化合物和至少一种芳族醛,酮或其混合物。 本发明的无氨酸锌电镀浴没有大量的络合剂,其将在处置之前阻止从浴中除去锌离子。