发明授权
- 专利标题： Bismuth-tin-indium-lead alloy
- 专利标题（中）： 铋锡铟锡铅合金
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申请号： US668447申请日： 1976-03-19
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公开(公告)号： US4083718A公开(公告)日： 1978-04-11
- 发明人: Hideki Murabayashi , Katsuhiko Kawakita , Kisaku Nakamura , Sadao Kobatake
- 申请人： Hideki Murabayashi , Katsuhiko Kawakita , Kisaku Nakamura , Sadao Kobatake
- 申请人地址： JA Tokyo
- 专利权人： Tokyo Shibaura Electric Co., Ltd.
- 当前专利权人： Tokyo Shibaura Electric Co., Ltd.
- 当前专利权人地址： JA Tokyo
- 优先权： JA50-32939 19750320
- 主分类号： C22C12/00
- IPC分类号： C22C12/00 ; C22C13/00 ; C22C13/02 ; G21C13/073 ; C22C30/04
摘要：
Disclosed is a bismuth-tin-indium-lead alloy consisting essentially of 28 to 72 weight % of bismuth, 25 to 52 weight % of tin, 2 to 12 weight % of indium and 1 to 8 weight % of lead. This alloy has excellent sealing property and oxidation resistance, and is suitable particularly to the use as a seal material for a rotating plug of a nuclear reactor.
公开/授权文献
- US5928825A Toner for developing electrostatic latent images 公开/授权日：1999-07-27
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