A current-distributing arrangement for electrical components includes an electrical circuit board having opposite sides, and conductive paths at one of the sides. A mounting member is mounted at the other of the sides. This mounting member has first wall portions which bound first sockets, and second wall portions which bound second sockets and which are raised relative to the first wall portions in direction away from said one side of the board. Spring contact members each having resilient contact portions are located in the second sockets for receiving electrical components therein with which electrical contact is made. Each spring contact member has a solderable portion connected with the contact portions and extending away from the latter in direction from the other side of the board towards and beyond said one side thereof so that solder contact may be made with the conductive paths only at said one side of the board.