发明授权
- 专利标题： Process for coating electric or electronic elements
- 专利标题（中）： 电子或电子元件涂层工艺
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申请号： US751627申请日： 1976-12-17
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公开(公告)号： US4122211A公开(公告)日： 1978-10-24
- 发明人: Toyoji Kikuga , Masayuki Nakamura , Tateo Goto , Tosaku Amakawa
- 申请人： Toyoji Kikuga , Masayuki Nakamura , Tateo Goto , Tosaku Amakawa
- 申请人地址： JPX Tokyo
- 专利权人： Sumitomo Durez Company, Ltd.
- 当前专利权人： Sumitomo Durez Company, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX50/153958 19751225
- 主分类号： B05D1/24
- IPC分类号： B05D1/24 ; B05D1/36 ; H01B3/30 ; H01B3/40 ; H01B17/62 ; H01B19/04 ; H01L21/56 ; H01L23/29 ; H01L23/31 ; B05D1/04
摘要：
A process for coating electronic elements comprises the steps of (1) forcibly impregnating an element with a liquid thermosetting resin undercoat, (2) depositing a powdered coating material on the element as a topcoat by electrostatic fluidized bed dip coating the element before the undercoat is dry, and (3) curing the resin by heating.
公开/授权文献
- US5921074A Pivotless mechanical crop harvester 公开/授权日：1999-07-13
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