发明授权
- 专利标题: Circuit board wire trimming apparatus
- 专利标题(中): 电路板修线装置
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申请号: US855901申请日: 1977-11-29
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公开(公告)号: US4200018A公开(公告)日: 1980-04-29
- 发明人: Mitsunao Sekiwa
- 申请人: Mitsunao Sekiwa
- 申请人地址: JPX Kodama
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Kodama
- 优先权: JPX51-143866 19761129; JPX51-160387[U]JPX 19761129
- 主分类号: H05K13/04
- IPC分类号: H05K13/04 ; B23D33/02 ; B26D7/06
摘要:
First and second elongated support members for supporting a circuit board and for transporting the circuit board in one direction parallel to the lengthwise direction of the support members are provided on a frame, and a blade member is rotatably supported on the frame for rotation about its own axis in a plane parallel to the plane of the circuit board. While the circuit board is being transported with opposed edges of the circuit board guided along the support member, the blade member trims excessive length from wires extending from the circuit board.
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