发明授权
- 专利标题: Soluble photosensitive resin composition
- 专利标题(中): 可溶性光敏树脂组合物
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申请号: US945341申请日: 1978-09-25
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公开(公告)号: US4209581A公开(公告)日: 1980-06-24
- 发明人: Hiroshi Takanashi , Toshimi Aoyama , Hisashi Nakane
- 申请人: Hiroshi Takanashi , Toshimi Aoyama , Hisashi Nakane
- 申请人地址: JPX Kawasaki
- 专利权人: Tokyo Ohka Kogyo Kabushiki Kaisha
- 当前专利权人: Tokyo Ohka Kogyo Kabushiki Kaisha
- 当前专利权人地址: JPX Kawasaki
- 主分类号: C08F299/00
- IPC分类号: C08F299/00 ; C08F290/00 ; C08G12/00 ; C08G12/10 ; C08G12/12 ; C08G12/22 ; G03F7/032 ; G03F7/038 ; G03C1/68
摘要:
A photocurable soluble resin suitable for manufacturing photosensitive resin plates obtained by polycondensing an alkylol derivative or an alkylated alkylol derivative of urea or thiourea with an N-alkylolacrylamide or N-alkylolmethacrylamide in the presence of an acid or an ammonium salt thereof or by reacting urea or thiourea with formaldehyde to form a linear polycondensation product and then grafting an N-alkylolacrylamide or N-alkylolmethacrylamide on the linear polycondensation product in the presence of an acid or an ammonium salt thereof. This soluble resin is incorporated with known soluble resins such as soluble nylon, photosensitizers and thermal polymerization inhibitors and mixed thoroughly to obtain a soluble photosensitive resin composition.
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