Invention Grant
- Patent Title: Microwave integrated circuit device
- Patent Title (中): 微波集成电路器件
-
Application No.: US954118Application Date: 1978-10-24
-
Publication No.: US4255730APublication Date: 1981-03-10
- Inventor: Kenji Sekine , Yoichi Kaneko
- Applicant: Kenji Sekine , Yoichi Kaneko
- Applicant Address: JPX
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JPX
- Main IPC: G01S7/03
- IPC: G01S7/03 ; H03B9/14 ; H03D7/02 ; H03D9/06 ; H01P5/00 ; G01S13/00 ; H03D9/02 ; H04B1/40
Abstract:
A microwave integrated circuit device for reception wherein a microwave integrated circuit substrate is mounted on a short-circuited plane of an inner surface of a waveguide, a rectangular groove is provided in the short-circuited plane, and a mixer diode is arranged astride the groove.
Public/Granted literature
- US5819764A Hermetically-sealed cosmetic compact Public/Granted day:1998-10-13
Information query
