发明授权
- 专利标题: Process for controlling of chemical copper plating solution
- 专利标题(中): 化学镀铜液控制方法
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申请号: US106083申请日: 1979-12-21
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公开(公告)号: US4276323A公开(公告)日: 1981-06-30
- 发明人: Hitoshi Oka , Kenji Nakamura
- 申请人: Hitoshi Oka , Kenji Nakamura
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 主分类号: C23C18/16
- IPC分类号: C23C18/16 ; C23C3/02
摘要:
A concentration of copper ions, a concentration of a reducing agent, a concentration of a complexing agent and a pH of a chemical copper plating solution are continuously detected all as potentials, and continuously controlled with a good accuracy.
公开/授权文献
- USD424213S Deck railing extrusion 公开/授权日:2000-05-02