发明授权
- 专利标题: Electronic parts mounting apparatus
- 专利标题(中): 电子零件安装装置
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申请号: US115279申请日: 1980-01-25
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公开(公告)号: US4327482A公开(公告)日: 1982-05-04
- 发明人: Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
- 申请人: Shigeru Araki , Yasuo Taki , Kazuhiro Mori , Yoshihiko Misawa , Souhei Tanaka
- 申请人地址: JPX Osaka
- 专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人: Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址: JPX Osaka
- 优先权: JPX54/7764 19790125
- 主分类号: H05K13/02
- IPC分类号: H05K13/02 ; B23P21/00 ; H05K13/00 ; H05K13/04 ; H05K13/08 ; H05K3/32
摘要:
An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side, a separator for separating the tape from the carrier; and a pick up device for picking up the electronic parts one-by-one from the recesses in the carrier and carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.
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