Surface relief patterns of predetermined configuration are fabricated by a process which involves exposing a photosensitive material at a first position to a laser interference pattern, rotating said material about an axis perpendicular to its surface to a second position, exposing said material at said second position to a laser interference pattern, wherein at least one and preferably both of said exposures is individually below the effective threshold for linear response of said material, the points of intersection of the two fringe patterns being exposed above said threshold as a result of the combined exposures, and developing said material. The method provides a facile technique for the manufacture of surface relief patterns and is particularly useful when the pattern is of submicrometer size and difficult to manufacture by mechanical means.