发明授权
- 专利标题： Heat distortion-resistant thermoplastic semi-conductive composition
- 专利标题（中）： 耐热变形热塑性半导体组合物
-
申请号： US388560申请日： 1982-06-15
-
公开(公告)号： US4451536A公开(公告)日： 1984-05-29
- 发明人: Anthony Barlow , Lawrence A. Meeks
- 申请人： Anthony Barlow , Lawrence A. Meeks
- 申请人地址： NY New York
- 专利权人： National Distillers and Chemical Corporation
- 当前专利权人： National Distillers and Chemical Corporation
- 当前专利权人地址： NY New York
- 主分类号： C08L23/00
- IPC分类号： C08L23/00 ; C08K3/02 ; C08K3/04 ; C08L23/08 ; C08L31/04 ; C08L33/00 ; C08L33/02 ; C08L101/00 ; H01B1/18 ; H01B1/24 ; H01L21/331 ; H01L29/73 ; H01L51/05 ; H01L51/30 ; H01B17/64
摘要：
A heat distortion-resistant thermoplastic semi-conductive composition which includes ethylene-vinyl acetate and/or an ethylene acrylate ester copolymer, and an admixture of high density polyethylene and linear low density polyethylene in addition to the electrically conductive component and other additives normally forming part of such compositions.