发明授权
- 专利标题： Mounting apparatus for leadless electronic parts
- 专利标题（中）： 无铅电子零件安装装置
-
申请号： US414256申请日： 1982-08-12
-
公开(公告)号： US4451976A公开(公告)日： 1984-06-05
- 发明人: Takayuki Fujita , Yoshiaki Yoshida , Toshiyuki Higashiura , Kunio Tanaka
- 申请人： Takayuki Fujita , Yoshiaki Yoshida , Toshiyuki Higashiura , Kunio Tanaka
- 申请人地址： JPX Kadoma
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX Kadoma
- 优先权： JPX55-179456 19801217
- 主分类号： H05K13/04
- IPC分类号： H05K13/04 ; H05K3/32
摘要：
The present invention relates to a mounting apparatus for leadless electronic parts wherein leadless electronic parts 3 supplied through a cylindrical chute 5 are dropped one by one into a part holding hole 7 of a part feeding pusher 6, with the part holding hole having a cutout, the part feeding pusher 6 transports the leadless electronic part 3 between chucks 10 and 11, and then a main block 8 including the chucks 10 and 11 is pivoted such that the leadless electronic parts 3 are taken out and mounted on a mounting portion of a printed circuit board 1 rapidly and reliably.
公开/授权文献
- US5093305A Heat-sensitive recording material 公开/授权日：1992-03-03
信息查询
