发明授权
- 专利标题： Ceramic wiring boards
- 专利标题（中）： 陶瓷接线板
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申请号： US374874申请日： 1982-05-04
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公开(公告)号： US4465727A公开(公告)日： 1984-08-14
- 发明人: Tsuyoshi Fujita , Noriyuki Taguchi , Gyozo Toda , Takashi Kuroki , Shoosaku Ishihara
- 申请人： Tsuyoshi Fujita , Noriyuki Taguchi , Gyozo Toda , Takashi Kuroki , Shoosaku Ishihara
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd.
- 当前专利权人： Hitachi, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX56-68889 19810509
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; B32B9/00 ; B32B15/04 ; B32B18/00 ; H01L23/498 ; H01L23/538 ; H05K1/03 ; H05K1/09 ; H05K3/00 ; B32B3/24 ; H05K1/04
摘要：
A ceramic wiring board which comprises ceramic part in which through-holes are made, sintered wiring pattern part provided on the surface of said ceramic part and sintered conductor part filled in said through-holes shows much decrease in cracks at the through-hole part caused by sintering and remarkable reduction in moisture absorbency when the ceramic part comprises ceramic containing a sintering assistant and the sintered conductor part comprises a metal containing the same sintering assistant as that present in said ceramic part.
公开/授权文献
- US5618207A Retaining method and double-retaining connector therefor 公开/授权日：1997-04-08
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