摘要:
A ceramic wiring board which comprises ceramic part in which through-holes are made, sintered wiring pattern part provided on the surface of said ceramic part and sintered conductor part filled in said through-holes shows much decrease in cracks at the through-hole part caused by sintering and remarkable reduction in moisture absorbency when the ceramic part comprises ceramic containing a sintering assistant and the sintered conductor part comprises a metal containing the same sintering assistant as that present in said ceramic part.
摘要:
A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.
摘要:
The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof.The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.
摘要:
In a rear projection screen, a plurality of convex lenses of the prescribed configuration are made of photoresist and formed and arranged on a surface or surfaces of a substrate in the prescribed pattern. In case that the convex lenses are formed in the shapes of ellipsoid, the longer radial direction of the ellipsoid is made to coincide with the horizontal direction and shapes of the lenses are changed gradually from the center of the screen to the extremity thereof. Bottom surfaces of non-lens boundary grooves between adjacent convex lenses are made rougher than the convex lens surfaces. A screen manufacturing method comprises the steps of applying photoresist onto a surface or surfaces of a substrate, exposing a patttern of boundary grooves onto the photoresist by photolithography, forming the boundary grooves by etching, and heating and melting the photoresist which is formed with the boundary grooves so as to form a plurality of convex lenses having the prescribed configuration. Further, it is possible to form a plurality of convex lenses of the prescribed configuration by rotating the substrate about the center thereof in the horizontal plane following the heating and melting step. In addition, it is possible, in forming the boundary grooves, to change the setting conditions of etching so that the bottom surfaces of the boundary grooves are made rougher than the convex lens surfaces.
摘要:
A plasma treatment apparatus and method are provided, which have the capability of maintaining a stable discharge, achieving a sufficient plasma treatment, and reducing plasma temperature. In this apparatus, electrodes are arranged to define a discharge space therebetween, and a dielectric material is disposed at a discharge-space side of at least one of the electrodes. A voltage is applied between the electrodes, while a plasma generation gas being supplied into the discharge space, to develop the discharge in the discharge space under a pressure substantially equal to atmospheric pressure, and provide the plasma generated by the discharge from the discharge space. A waveform of the voltage applied between the electrodes is an alternating voltage waveform without rest period. At least one of rising and falling times of the alternating voltage waveform is 100 μsec or less. A repetition frequency is in a range of 0.5 to 1000 kHz. An electric-field intensity applied between the electrodes is in a range of 0.5 to 200 kV/cm.
摘要:
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要:
Production of hollow carbon fibers and hollow carbon particles includes baking and carbonization of polymer particles having a specified volume after deformation. A metal-deposited carbon fiber with metal deposited inside and/or outside the hollow carbon fiber is applicable to electron discharge devices. The thickness and crystallinity of the graphite layer can be freely controlled. Since almost no by-product is generated, separation and refining using a solvent is not required. A hollow carbon particle of desired shape can be produced at a high yield rate. The hollow carbon fiber represented by a carbon nano-tube can be controlled in such a way that a low resistance and uniform shape are provided so that there is an increase in the amount of electrons discharged from the hollow carbon fiber. Use of this hollow carbon fiber as an electron discharge source provides an excellent electron discharge device characterized by stable pixels.
摘要:
The purpose of the present invention is to provide an easy-to-manufacture electromagnetic wave absorption material usable from submillimeter wave region to millimeter wave region with an excellent radio wave absorbing performance and a variety of usage thereof. The present invention is characterized by an electromagnetic wave absorption material comprised of a dispersions of at least one of the materials: a multi-layer hollow globule of carbon, a schungite carbon, and the schungite ore; mixed into a matter having a high electrical resistivity. The invention is further characterized by an electronic device, an optical transmission module, an optical reception module, a high frequency telecommunication equipment, and a stop-free automated tollgate system, wherein at least a part of their board, electronic element, and circuit wiring are covered with said electromagnetic wave absorption material.
摘要:
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.
摘要:
A semiconductor package substrate is provided, which can meet the move toward high integration of semiconductors. A nickel layer is plated on an electroplated copper foil to form a wiring pattern. An LSI chip is mounted on the copper foil, and terminals of the LSI chip and the wiring pattern are connected by wire bonding, followed by sealing with a semiconductor-sealing epoxy resin. Only the copper foil is dissolved away with an alkali etchant to expose nickel. With a nickel stripper having low copper-dissolving power, the nickel layer is removed to expose the wiring pattern. A solder resist is coated, and a pattern is formed in such a way that connecting terminal portions are exposed. Solder balls are placed at the exposed portions of the wiring pattern and are then fused. The wiring pattern is connected to an external printed board via the solder balls.