发明授权
- 专利标题： Palladium plating prodedure
- 专利标题（中）： 钯电镀
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申请号： US477588申请日： 1983-03-21
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公开(公告)号： US4486274A公开(公告)日： 1984-12-04
- 发明人: Joseph A. Abys , Harvey S. Trop
- 申请人： Joseph A. Abys , Harvey S. Trop
- 申请人地址： NJ Murray Hill
- 专利权人： AT&T Bell Laboratories
- 当前专利权人： AT&T Bell Laboratories
- 当前专利权人地址： NJ Murray Hill
- 主分类号： C25D3/52
- IPC分类号： C25D3/52 ; C25D3/56 ; C25D3/58 ; C25D3/64
摘要：
A palladium electroplating procedure is disclosed which permits rapid and efficient plating and yields ductile, adherent palladium films. The electroplating bath comprises a unique palladium complex. The procedure is also useful for electroplating a variety of palladium alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.
公开/授权文献
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