公开(公告)号：US10017863B2

公开(公告)日：2018-07-10

申请号：US11766642

申请日：2007-06-21

Applicant: Joseph A. Abys ,  Shenliang Sun ,  Edward J. Kudrak ,  Katrin Zschintzsch ,  Theodore Antonellis

Inventor： Joseph A. Abys ,  Shenliang Sun ,  Edward J. Kudrak ,  Katrin Zschintzsch ,  Theodore Antonellis

IPC: C23F11/00 ,  C23F11/10 ,  C23C22/03

CPC classification number: C23F11/10 ,  C23C22/03

Abstract: A method and composition for enhancing corrosion resistance, wear resistance, and contact resistance of a substrate comprising a copper or copper alloy surface. The composition comprises a phosphorus oxide compound selected from the group consisting of a phosphonic acid, a phosphonate salt, a phosphonate ester, a phosphoric acid, a phosphate salt, a phosphate ester, and mixtures thereof; a nitrogen-containing organic compound selected from the group consisting of primary amine, secondary amine, tertiary amine, and aromatic heterocycle comprising nitrogen; and an alcohol.

公开(公告)号：US09217205B2

公开(公告)日：2015-12-22

申请号：US12747681

申请日：2008-12-10

Applicant: Joseph A. Abys ,  Edward J. Kudrak, Jr. ,  Jingye Li ,  Chen Xu ,  Chonglun Fan

Inventor： Joseph A. Abys ,  Edward J. Kudrak, Jr. ,  Jingye Li ,  Chen Xu ,  Chonglun Fan

IPC: C25D15/02 ,  C25D3/02

CPC classification number: C25D15/02 ,  C25D3/02 ,  C25D15/00

Abstract: A method is provided for imparting corrosion resistance onto a surface of a substrate. The method comprises contacting the surface of the substrate with an electrolytic plating solution comprising (a) a source of deposition metal ions of a deposition metal selected from the group consisting of zinc, palladium, silver, nickel, copper, gold, platinum, rhodium, ruthenium, chrome, and alloys thereof, (b) a pre-mixed dispersion of non-metallic nano-particles, wherein the non-metallic particles have a pre-mix coating of surfactant molecules thereon; and applying an external source of electrons to the electrolytic plating solution to thereby electrolytically deposit a metal-based composite coating comprising the deposition metal and non-metallic nano-particles onto the surface.

Abstract translation: 提供了一种赋予衬底表面的耐腐蚀性的方法。 该方法包括使基板的表面与电解电镀溶液接触，所述电解电镀溶液包括（a）选自锌，钯，银，镍，铜，金，铂，铑等的沉积金属的沉积金属离子源， 钌，铬及其合金，（b）非金属纳米颗粒的预混合分散体，其中所述非金属颗粒在其上具有表面活性剂分子的预混合涂层; 以及将外部电子源施加到所述电解电镀溶液中，从而将包含所述沉积金属和非金属纳米颗粒的金属基复合涂层电沉积到所述表面上。

公开(公告)号：US20140120722A1

公开(公告)日：2014-05-01

申请号：US13981974

申请日：2012-01-26

Applicant: Thomas B. Richardson ,  Joseph A. Abys ,  Wenbo Shao ,  Chen Wang ,  Vincent Paneccasio, JR. ,  Cai Wang ,  Xuan Lin ,  Theodore Antonellis

Inventor： Thomas B. Richardson ,  Joseph A. Abys ,  Wenbo Shao ,  Chen Wang ,  Vincent Paneccasio, JR. ,  Cai Wang ,  Xuan Lin ,  Theodore Antonellis

IPC: H01L21/768

CPC classification number: H01L21/2885 ,  C25D3/38 ,  C25D5/02 ,  C25D5/18 ,  C25D7/123 ,  H01L21/76873 ,  H01L21/76879 ,  H01L21/76898

Abstract: A process for metalizing a through silicon via feature in a semiconductor integrated circuit device, the process including, during the filling cycle, reversing the polarity of circuit for an interval to generate an anodic potential at said metalizing substrate and desorb leveler from the copper surface within the via, followed by resuming copper deposition by re-establishing the surface of the copper within the via as the cathode in the circuit, thereby yielding a copper filled via feature.

Abstract translation: 一种用于在半导体集成电路器件中通过硅通孔特征进行金属化的工艺，该过程包括在填充周期期间使电路的极性反转一段间隔以在所述金属化衬底处产生阳极电位，并从铜表面解吸整齐器 通孔，然后通过重新建立通孔内的铜的表面作为电路中的阴极来恢复铜沉积，由此产生铜填充的通孔特征。

公开(公告)号：US20130199935A1

公开(公告)日：2013-08-08

申请号：US13699910

申请日：2011-05-24

Applicant: Thomas B. Richardson ,  Wenbo Shao ,  Xuan Lin ,  Cai Wang ,  Vincent Paneccasio, JR. ,  Joseph A. Abys ,  Yun Zhang ,  Richard Hurtubise ,  Chen Wang

Inventor： Thomas B. Richardson ,  Wenbo Shao ,  Xuan Lin ,  Cai Wang ,  Vincent Paneccasio, JR. ,  Joseph A. Abys ,  Yun Zhang ,  Richard Hurtubise ,  Chen Wang

IPC: C25D3/38

CPC classification number: C25D3/38 ,  C25D5/02 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76898

Abstract: A method for metallizing a through silicon via feature in a semiconductor integrated circuit device substrate. The method comprises immersing the semiconductor integrated circuit device substrate into an electrolytic copper deposition composition, wherein the through silicon via feature has an entry dimension between 1 micrometers and 100 micrometers, a depth dimension between 20 micrometers and 750 micrometers, and an aspect ratio greater than about 2:1; and supplying electrical current to the electrolytic deposition composition to deposit copper metal onto the bottom and sidewall for bottom-up filling to thereby yield a copper filled via feature. The deposition composition comprises (a) a source of copper ions; (b) an acid selected from among an inorganic acid, organic sulfonic acid, and mixtures thereof; (c) an organic disulfide compound; (d) a compound selected from the group consisting of a reaction product of benzyl chloride and hydroxyethyl polyethyleneimine, a quaternized dipyridyl compound, and a combination thereof; and (d) chloride ions.

Abstract translation: 一种用于在半导体集成电路器件衬底中金属化硅通孔特征的方法。 该方法包括将半导体集成电路器件衬底浸入电解铜沉积组合物中，其中贯穿硅通孔特征具有介于1微米至100微米之间的入口尺寸，20微米至750微米的深度尺寸，以及大于 约2：1; 向电解沉积组合物供给电流以将铜金属沉积到底部和侧壁上以进行自底向上填充，由此产生铜填充的通孔特征。 沉积组合物包含（a）铜离子源; （b）选自无机酸，有机磺酸及其混合物的酸; （c）有机二硫化物; （d）选自苄基氯和羟乙基亚乙基亚胺的反应产物，季铵化吡啶基化合物及其组合的化合物; 和（d）氯离子。

公开(公告)号：US08323741B2

公开(公告)日：2012-12-04

申请号：US13545030

申请日：2012-07-10

Applicant: Joseph A. Abys ,  Shenliang Sun ,  Theodore Antonellis

Inventor： Joseph A. Abys ,  Shenliang Sun ,  Theodore Antonellis

IPC: B05D3/10

CPC classification number: C23C22/02 ,  C23F11/08 ,  C23F11/10 ,  C23F11/149 ,  H05K3/244 ,  H05K3/282 ,  H05K2203/122 ,  H05K2203/124 ,  Y10T428/12556

Abstract: A composition for enhancing the corrosion resistance of an article comprising a silver coating deposited on a solderable copper substrate. The composition comprises: a) a multi-functional molecule comprising at least one organic functional group that interacts with and protects copper surfaces and at least one organic functional group that interacts with and protects silver surfaces; b) an alcohol; and c) a surfactant.

Abstract translation: 一种用于增强包含沉积在可焊铜衬底上的银涂层的制品的耐腐蚀性的组合物。 所述组合物包含：a）包含与铜表面相互作用并保护铜表面的至少一种有机官能团和与银表面相互作用并保护银表面的至少一个有机官能团的多功能分子; b）酒精; 和c）表面活性剂。

公开(公告)号：US20120168075A1

公开(公告)日：2012-07-05

申请号：US12933750

申请日：2009-03-23

Applicant: Joseph A. Abys ,  Theodore Antonellis ,  Shenliang Sun ,  Abayomi I. Owei ,  Eric Walch ,  Jean Rasmussen ,  Hanna Rasmussen

Inventor： Joseph A. Abys ,  Theodore Antonellis ,  Shenliang Sun ,  Abayomi I. Owei ,  Eric Walch ,  Jean Rasmussen ,  Hanna Rasmussen

IPC: C09J5/02 ,  C09J11/02

CPC classification number: H05K3/383 ,  C23C28/00 ,  C23C2222/20 ,  C23F1/18 ,  C23F11/149 ,  H05K3/389 ,  H05K2203/124

Abstract: An adhesion promotion composition and method for enhancing adhesion between a copper conducting layer and a dielectric material during manufacture of a printed circuit board. The adhesion promotion composition comprises a multi-functional compound comprising a first functional group and a second functional group, wherein the first functional group is an aromatic heterocyclic compound comprising nitrogen and the second functional group is selected from the group consisting of vinyl ether, amide, thiamide, amine, carboxylic acid, ester, alcohol, silane, alkoxy silane, and combinations thereof.

Abstract translation: 一种用于在印刷电路板的制造期间增强铜导电层和介电材料之间的粘附性的粘合促进组合物和方法。 粘合促进组合物包含含有第一官能团和第二官能团的多官能化合物，其中第一官能团是包含氮的芳族杂环化合物，第二官能团选自乙烯基醚，酰胺， 硫胺，胺，羧酸，酯，醇，硅烷，烷氧基硅烷及其组合。

公开(公告)号：US20100291303A1

公开(公告)日：2010-11-18

申请号：US11944287

申请日：2007-11-21

Applicant: Joseph A. Abys ,  Shenliang Sun ,  Theodore Antonellis

Inventor： Joseph A. Abys ,  Shenliang Sun ,  Theodore Antonellis

IPC: B05D3/10

CPC classification number: H05K3/282 ,  C08K5/17 ,  C08K5/37 ,  C09D5/086 ,  C09D7/63 ,  C23C18/54 ,  C23F11/10 ,  C23F11/149 ,  C23F11/161 ,  H05K3/244 ,  H05K2203/122 ,  H05K2203/124

Abstract: A method is disclosed for enhancing the corrosion resistance of a surface of a copper or copper alloy substrate. The method comprises depositing a metallic surface layer comprising a precious metal on a surface of the copper or copper alloy substrate by immersion displacement plating and exposing the electronic device to an aqueous composition comprising a first organic molecule comprising at least one functional group that interacts with and protects precious metal surfaces and a second organic molecule comprising at least one functional group that interacts with and protects copper surfaces.

Abstract translation: 公开了一种提高铜或铜合金基板的表面的耐腐蚀性的方法。 该方法包括通过浸渍移置电镀将包含贵金属的金属表面层沉积在铜或铜合金基底的表面上，并将电子器件暴露于水性组合物，该含水组合物包含至少一个与 保护贵金属表面和包含与铜表面相互作用并保护铜表面的至少一个官能团的第二有机分子。

公开(公告)号：US20090145765A1

公开(公告)日：2009-06-11

申请号：US12254207

申请日：2008-10-20

Applicant: Joseph A. Abys ,  Jingye Li ,  Edward J. Kudrak, JR. ,  Chen Xu

Inventor： Joseph A. Abys ,  Jingye Li ,  Edward J. Kudrak, JR. ,  Chen Xu

IPC: C25D15/00

CPC classification number: C25D15/02 ,  C25D3/30 ,  H01R13/03

Abstract: There is provided a method and composition for applying a wear resistant composite coating onto a metal surface of an electrical component. The method comprises contacting the metal surface with an electrolytic plating composition comprising (a) a source of tin ions and (b) non-metallic particles, and applying an external source of electrons to the electrolytic plating composition to thereby electrolytically deposit the composite coating onto the metal surface, wherein the composite coating comprises tin metal and the non-metallic particles.

Abstract translation: 提供了一种将耐磨复合涂层施加到电气部件的金属表面上的方法和组合物。 该方法包括使金属表面与包含（a）锡离子源和（b）非金属颗粒的电解电镀组合物接触，并将外部电子源施加到电解镀覆组合物，从而将复合涂层电解沉积到 金属表面，其中复合涂层包括锡金属和非金属颗粒。

公开(公告)号：US20080163787A1

公开(公告)日：2008-07-10

申请号：US11620857

申请日：2007-01-08

Applicant: Joseph A. Abys ,  Shenliang Sun

Inventor： Joseph A. Abys ,  Shenliang Sun

IPC: C04B9/02

CPC classification number: H05K3/282 ,  B23K35/3612 ,  C23C22/52 ,  C23F11/08 ,  C23F11/149 ,  H05K2203/0392 ,  H05K2203/124

Abstract: An organic solderability preservative (OSP) composition comprising an alkyl cyclic alcohol and an azole compound having enhanced composition stability against crystallization of the azole compound.

Abstract translation: 一种有机可焊性防腐剂（OSP）组合物，其包含烷基环醇和唑类化合物，其对唑类化合物的结晶具有增强的组合物稳定性。

公开(公告)号：US4427502A

公开(公告)日：1984-01-24

申请号：US321180

申请日：1981-11-16

Applicant: Joseph A. Abys

Inventor： Joseph A. Abys

IPC: C25D3/52 ,  C25D3/56

CPC classification number: C25D3/567 ,  C25D3/52

Abstract: A procedure is described for electroplating platinum and platinum alloys. This procedure permits rapid electroplating of platinum and yields platinum films with excellent properties. The electroplating bath comprises a unique platinum complexing agent, namely an organic polyamine compound. The procedure is also useful for electroplating a variety of platinum alloys. In addition, the bath is highly stable and does not adversely affect the base material being plated.

Abstract translation: 对铂和铂合金的电镀进行了描述。 该方法允许铂的快速电镀，并产生具有优异性能的铂膜。 电镀浴包含独特的铂络合剂，即有机多胺化合物。 该方法对于电镀各种铂合金也是有用的。 此外，浴是高度稳定的，并且不会对被镀的基材产生不利影响。