发明授权
- 专利标题： Thermal development type diazo copying material with hydrophobic resin encapsulated coupler particle
- 专利标题（中）： 热开发型重氮复制材料与疏水树脂封装的耦合剂颗粒
-
申请号： US384308申请日： 1982-06-02
-
公开(公告)号： US4497887A公开(公告)日： 1985-02-05
- 发明人: Nobuyoshi Watanabe , Tsutomu Matsuda
- 申请人： Nobuyoshi Watanabe , Tsutomu Matsuda
- 申请人地址： JPX Tokyo
- 专利权人： Ricoh Compay, Ltd.
- 当前专利权人： Ricoh Compay, Ltd.
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX56-88530 19810609
- 主分类号： G03C1/52
- IPC分类号： G03C1/52 ; G03C1/60 ; G03C1/58
摘要：
A thermal development type diazo copying material comprising a support material and a photosensitive layer formed on the support material, which photosensitive layer comprises a diazo compound, a coupling component and a thermo-fusible auxiliary coloring agent, and which coupling component is capsulated by a hydrophobic polymeric material with a softening point ranging from 50.degree. C. to 150.degree. C. selected from the group consisting of hydrophobic polyester resins, hydrophobic cellulose resins, hydrophobic polyamide resins and hydrophobic polyurethane resins.
公开/授权文献
- US5689653A Vector memory operations 公开/授权日：1997-11-18