发明授权
- 专利标题: Compound die assembly
- 专利标题(中): 复合模组件
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申请号: US415978申请日: 1982-09-08
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公开(公告)号: US4501179A公开(公告)日: 1985-02-26
- 发明人: Satoshi Iwata
- 申请人: Satoshi Iwata
- 申请人地址: JPX
- 专利权人: Iwata; Tetsutaro
- 当前专利权人: Iwata; Tetsutaro
- 当前专利权人地址: JPX
- 主分类号: B21D28/34
- IPC分类号: B21D28/34 ; B23H9/12 ; B26F1/14
摘要:
A compound die assembly adapted to produce large-sized parts having a plurality of holes, complicated holes and/or lengthy holes wherein a blanking die (103) and a blanking punch (203) are made by wire-cut electro-discharge machining and are directly fixed onto a punch holder (101) and a die holder (201), respectively, a knockout plate (109) and a stripper plate (204) are also made by wire-cut electro-discharge machining and are fixed by hanger bolts onto the punch holder and the die holder through polyurethane rubbers (111, 206), respectively. Guide posts (30) are fixed to the punch holder and extends through the die holder downwardly. A mount (40) to be fixed onto the press bolster has a flat top surface on which the die holder is fixedly mounted and has a plurality of guide-post-receiving holes (401) in which coil springs (402) are contained to raise the guide posts received together with the punch holder. A plurality of load-supporting elements (50) are fixed onto the bottom surface of the die holder near slug clearance holes thereof.
公开/授权文献
- US5554852A Ion implantation having increased source lifetime 公开/授权日:1996-09-10
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