发明授权
- 专利标题： Plastic encapsulated semiconductor device and method for manufacturing the same
- 专利标题（中）： 塑料封装半导体器件及其制造方法
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申请号： US378435申请日： 1982-05-14
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公开(公告)号： US4503452A公开(公告)日： 1985-03-05
- 发明人: Masami Yokozawa , Isao Kanai
- 申请人： Masami Yokozawa , Isao Kanai
- 申请人地址： JPX Osaka
- 专利权人： Matsushita Electronics Corporation
- 当前专利权人： Matsushita Electronics Corporation
- 当前专利权人地址： JPX Osaka
- 优先权： JPX56-75444 19810518
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/56 ; H01L23/28 ; H01L23/31 ; H01L23/495 ; H01L21/58 ; H01L23/00 ; H01L23/34
摘要：
A plastic encapsulated semiconductor device and a method for manufacturing the same are provided. A substrate support supports a semiconductor substrate and serves as a heat sink. Strips are connected to one side of the substrate support and an external lead is connected to the opposite side of the substrate support. Parts of the strips extend from one side surface of a plastic encapsulating housing. At least one notch or recess is formed in one side surface of the plastic encapsulating housing. The strips are then cut within at least one notch or recess so as not to extend the cut surfaces of the strips from the outermost side surface portion of the encapsulating housing.
公开/授权文献
- US6112152A RFID system in communication with vehicle on-board computer 公开/授权日：2000-08-29