发明授权
- 专利标题: Laser machining system
- 专利标题(中): 激光加工系统
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申请号: US581267申请日: 1984-02-17
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公开(公告)号: US4527043A公开(公告)日: 1985-07-02
- 发明人: Masayoshi Hashiura , Akiyasu Okazaki , Sigeru Suzuki
- 申请人: Masayoshi Hashiura , Akiyasu Okazaki , Sigeru Suzuki
- 申请人地址: JPX Tokyo
- 专利权人: Hitachi, Ltd.
- 当前专利权人: Hitachi, Ltd.
- 当前专利权人地址: JPX Tokyo
- 优先权: JPX58-24638 19830218
- 主分类号: B23K26/06
- IPC分类号: B23K26/06 ; B23K26/073
摘要:
In a laser machining system for the heat treatment of an object, a pair of cylindrical concave mirrors are used to receive a source laser beam and irradiate a linear laser beam on to the object. The system is further provided between the latter cylindrical mirror and the object with at least a pair of slant-type plane mirrors for conditioning the linear beam. The plane mirrors have means for variably making the lengthwise dimension of the output linear beam smaller than that of the incident linear beam, so that a linear laser beam of various lengthwise dimensions can be produced.
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