The present disclosure describes an insulated electrical contact pin for use in making wiring changes in an interconnection medium such as a printed circuit board or backplane. More specifically, the present pin replaces the original compliant press-fit type pin mounted in a plated-through hole on the board. The pin is formed in two sections--one section having a threaded extremity, and the other, a tapped bore to receive the former. The pin is mounted in a plated-through hole on the printed wiring board by screwing the two sections together. Portions of the pin sections are electrically insulated from the wiring traces situated on or below the board surface. The present contact pin is versatile, easy to install and tolerance-free with respect to the dimensions of the plated-through hole in which it is mounted.