发明授权
- 专利标题: Method for providing an electroless copper plating bath in the take mode
- 专利标题(中): 在取样模式下提供化学镀铜浴的方法
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申请号: US567723申请日: 1984-01-03
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公开(公告)号: US4534797A公开(公告)日: 1985-08-13
- 发明人: David E. King , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
- 申请人: David E. King , Voya Markovich , Carlos J. Sambucetti , Stephen L. Tisdale , Donna J. Trevitt
- 申请人地址: NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: NY Armonk
- 主分类号: H05K3/18
- IPC分类号: H05K3/18 ; C23C18/40 ; C23C3/02
摘要:
An electroless copper plating bath which is in the take mode is provided by determining the amount in the bath of at least four of the components selected from the group of oxygen, reducing agent, cyanide salt, cupric salt, and complexing agent; solving the equation:R=(CABD)/Ewherin C is the concentration of cupric salt, A is the concentration of reducing agent, B is the concentration of oxygen, D is the concentration of cyanide salt, E is the concentration of complexing agent, and R is a unitless number.The bath is provided with quantities of the above ingredients so that R in the equation is between about 5 and about 15.
公开/授权文献
- US5672097A Abrasive article for finishing 公开/授权日:1997-09-30
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