发明授权
- 专利标题： Ceramic bonded structure and method of manufacturing the same
- 专利标题（中）： 陶瓷粘结结构及其制造方法
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申请号： US599579申请日： 1984-04-12
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公开(公告)号： US4542073A公开(公告)日： 1985-09-17
- 发明人: Shun-ichiro Tanaka , Nobuyuki Mizunoya , Shigeo Abe
- 申请人： Shun-ichiro Tanaka , Nobuyuki Mizunoya , Shigeo Abe
- 申请人地址： FRX Paris FRX Sartrouville
- 专利权人： Thomson CSF,Compagnie d'Electronique et de Piezo-Electricite
- 当前专利权人： Thomson CSF,Compagnie d'Electronique et de Piezo-Electricite
- 当前专利权人地址： FRX Paris FRX Sartrouville
- 优先权： JPX58-63676 19830413
- 主分类号： C04B37/00
- IPC分类号： C04B37/00 ; C04B37/02 ; C04B41/80 ; B32B9/04 ; C09J1/00
摘要：
A ceramic bonded structure with a high bonding strength has a first member of a ceramic, a ceramic-modified bonding layer formed on at least a bonding surface of the first member by a thermal treatment, a metal layer formed on the ceramic-modified bonding layer, and a second member of a ceramic or metal bonded with the first member through the metal layer.
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