In an assembly of circuit components, such as a multiplicity of RF interference suppression filters, the filter elements (15) in a first array are secured to a first plate (16) at solder joints (17) and further filter elements (18) in a second array are secured to a second flat plate (19) at solder joints (20). The first array of filter elements (15) thus extend through apertures (21b) in the second plate (19) and the second array of filter elements (18) extend through apertures (21a) in the first plate (16). The plates (16) and (19) are secured together after the soldering operation and the interspersed arrays of filter elements (15) and (18) can be individually inspected as to the adequacy of the solder joint.