发明授权
- 专利标题： Ceramic multilayer wiring board
- 专利标题（中）： 陶瓷多层布线板
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申请号： US640582申请日： 1984-08-14
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公开(公告)号： US4604496A公开(公告)日： 1986-08-05
- 发明人: Shosaku Ishihara , Takashi Kuroki , Gyozo Toda , Akio Yasukawa , Tatsuji Sakamoto
- 申请人： Shosaku Ishihara , Takashi Kuroki , Gyozo Toda , Akio Yasukawa , Tatsuji Sakamoto
- 申请人地址： JPX Tokyo
- 专利权人： Hitachi, Ltd
- 当前专利权人： Hitachi, Ltd
- 当前专利权人地址： JPX Tokyo
- 优先权： JPX58-154052 19830825
- 主分类号： H05K3/46
- IPC分类号： H05K3/46 ; H05K1/03 ; H05K1/09 ; H05K3/40 ; H05K3/42 ; H05K1/02
摘要：
A ceramic multilayer wiring board is provided in which ceramic insulating layers and wiring patterns provided thereon are connected by conductors filling through-holes formed in the ceramic insulating layers. The through-holes are so formed that the superficial portions of each through-hole of the ceramic multilayer wiring board is smaller in diameter than the inside portion of the through-hole between the superficial portion. This can prevent the board from being cracked around the through-holes.
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