发明授权
- 专利标题： Method of controlling deposition amount distribution in a vacuum deposition plating
- 专利标题（中）： 控制真空沉积电镀中沉积量分布的方法
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申请号： US740553申请日： 1985-06-03
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公开(公告)号： US4612206A公开(公告)日： 1986-09-16
- 发明人: Yoshio Shimozato , Tetsuyoshi Wada , Kenichi Yanagi , Mitsuo Kato , Heizaburo Furukawa , Kanji Wake , Arihiko Morita , Norio Tsukiji , Takuya Aiko , Toshiharu Kittaka , Yasuji Nakanishi
- 申请人： Yoshio Shimozato , Tetsuyoshi Wada , Kenichi Yanagi , Mitsuo Kato , Heizaburo Furukawa , Kanji Wake , Arihiko Morita , Norio Tsukiji , Takuya Aiko , Toshiharu Kittaka , Yasuji Nakanishi
- 申请人地址： JPX Tokyo JPX Tokyo
- 专利权人： Nisshin Steel Company, Ltd.,Mitsubishi Jukogyo Kabushiki Kaisha
- 当前专利权人： Nisshin Steel Company, Ltd.,Mitsubishi Jukogyo Kabushiki Kaisha
- 当前专利权人地址： JPX Tokyo JPX Tokyo
- 优先权： JPX59-113195 19840604
- 主分类号： C23C14/54
- IPC分类号： C23C14/54 ; C23C14/24 ; C23C14/56 ; C23C16/00 ; C23C16/06
摘要：
In a continuous vacuum deposition plating of a metal strip, thinner coating at the edges can be prevented by maintaining the pressure of the deposition chamber in which an evaporation chamber is housed at a properly higher level than the pressure of the evaporation chamber.
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