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发明授权
US4619397A Method of and apparatus for bonding an electrically conductive wire to bonding pads 失效
将导电线接合到接合焊盘的方法和装置

  • 专利标题： Method of and apparatus for bonding an electrically conductive wire to bonding pads
  • 专利标题（中）： 将导电线接合到接合焊盘的方法和装置
  • 申请号： US677189
    申请日： 1984-12-03
  • 公开(公告)号： US4619397A
    公开(公告)日： 1986-10-28
  • 发明人: Peter Urban
  • 申请人： Peter Urban
  • 专利权人： Peter Urban
  • 当前专利权人： Peter Urban
  • 优先权： DEX3343738 19831202
  • 主分类号： H01L21/607
  • IPC分类号： H01L21/607 ;  B23K20/10 ;  B23K31/02
Method of and apparatus for bonding an electrically conductive wire to bonding pads
摘要：
A method and an apparatus for bonding a thin electrically conductive wire, especially an aluminum wire (11), to electrical bonding pads or areas (12, 14) of electric or electronic components (16), especially microchips or semiconductor components. To this end the wire (11) is briefly pressed against the bonding pad (12, 14) by means of an ultrasonically energized bonding wedge (10) and is subsequently severed at a small distance from the side (17) of the wedge (10) that is opposite to the wire feeding side (15) thereof. To prevent the formation of a wire tail (TL) protruding beyond the bonding length (BL), a wire clamping tool (21) is provided on the wire feeding side of the wedge (10) by means of which the wire (11), after having been severed and prior to another bonding operation, is moved back, preferably retracted, at least to such an extent that the free wire end is approximately flush with the side (17) of the wedge (10) which is opposite to the wire feeding side (15 ) thereof.
摘要（中）：

一种用于将薄导电线，特别是铝线（11）接合到电气或电子部件（16）的电接合焊盘或区域（12,14）的方法和装置，特别是微芯片或半导体部件。 为此，通过超声波通电的结合楔（10）将导线（11）短暂地压靠在焊盘（12,14）上，并且随后在与楔形件（10）的侧面（17）相距很小的距离处被切断 ），其与送丝侧（15）相对。 为了防止突出超过接合长度（BL）的线尾（TL）的形成，在楔（10）的送丝侧上设有线夹紧工具（21），通过该线（11）， 在被切断之后并且在另一个接合操作之前，被移回，优选地缩回，至少使得自由线端部与楔形件（10）的与线材相对的侧面（17）近似齐平 进料侧（15）。

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