发明授权
- 专利标题: Process for preventing melt-back in the production of aluminum-containing laser devices
- 专利标题(中): 制造含铝激光装置时防止熔融回收的方法
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申请号: US781707申请日: 1985-09-30
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公开(公告)号: US4632709A公开(公告)日: 1986-12-30
- 发明人: Mototaka Taneya , Sadayoshi Matsui , Mitsuhiro Matsumoto , Hiroshi Hayashi
- 申请人: Mototaka Taneya , Sadayoshi Matsui , Mitsuhiro Matsumoto , Hiroshi Hayashi
- 申请人地址: JPX Osaka
- 专利权人: Sharp Kabushiki Kaisha
- 当前专利权人: Sharp Kabushiki Kaisha
- 当前专利权人地址: JPX Osaka
- 优先权: JPX59-206930 19841002
- 主分类号: H01L21/20
- IPC分类号: H01L21/20 ; H01L21/208 ; H01S5/00
摘要:
A process for the production of semiconductor devices includes: (1) forming a thin semiconductor film containing no aluminum on a first semiconductor layer containing aluminum that is disposed on a substrate one or more (2) forming channels on said thin semiconductor film in such a manner that the channel or channels reach or go through said first semiconductor layer to expose a portion of said substrate, resulting in a channelled substrate for succeeding crystal growth thereon, and (3) producing by epitaxial growth crystalline layers on said channelled substrate by the use of a crystal growth solution having a supersaturation which is high enough to prevent said first semiconductor layer from undergoing meltback.
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