发明授权
US4656048A Method of forming thick film circuit patterns with a sufficiently wide
and uniformly thick strip
失效
形成具有足够宽且均匀厚的条带的厚膜电路图案的方法
- 专利标题： Method of forming thick film circuit patterns with a sufficiently wide and uniformly thick strip
- 专利标题（中）： 形成具有足够宽且均匀厚的条带的厚膜电路图案的方法
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申请号： US802950申请日： 1985-11-27
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公开(公告)号： US4656048A公开(公告)日： 1987-04-07
- 发明人: Shinichi Kudoh , Akira Kabeshita , Syuichi Murakami
- 申请人： Shinichi Kudoh , Akira Kabeshita , Syuichi Murakami
- 申请人地址： JPX
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX57-221433 19821216; JPX57-224307 19821220
- 主分类号： H01L21/70
- IPC分类号： H01L21/70 ; H05K3/12
摘要：
Disclosed is a method of forming a thick film circuit pattern according which involves moving a nozzle having a slit opening above the surface of a stationary substrate with the elongation of the slit opening being oriented at an angle to the direction of movement of the nozzle and forcing a paste in the nozzle downward through the slit opening onto the substrate to deposit a sufficiently wide and uniformly thick film strip. Preferably, the surface irregularities of the substrate are detected without contacting it for controlling the position of the slit opening above the substrate so that it follows closely parallel with the surface contour line of the substrate.
公开/授权文献
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