Invention Grant
- Patent Title: Solder cream
- Patent Title (中): 焊膏
-
Application No.: US825155Application Date: 1986-02-03
-
Publication No.: US4657589APublication Date: 1987-04-14
- Inventor: Felix Barajas
- Applicant: Felix Barajas
- Applicant Address: CA Long Beach
- Assignee: McDonnell Douglas Corporation
- Current Assignee: McDonnell Douglas Corporation
- Current Assignee Address: CA Long Beach
- Main IPC: B23K35/02
- IPC: B23K35/02 ; B23K35/36 ; H05K3/34 ; C09D5/00 ; B23K35/34
Abstract:
A solder composition containing a small amount of gold added to the solder metal, to avoid cracking of solder joints in electronic circuits, particularly densely packed microelectronic circuits, during thermal cycling. The solder composition comprises 85 to 90% of total solder metal and 10 to 15% of a vehicle for the solder metal, the solder metal containing about 0.2 to about 3% of particulate gold, by weight of the solder metal.
Public/Granted literature
- US4285596A Holographic diffraction grating system for rapid scan spectral analysis Public/Granted day:1981-08-25
Information query
