A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.