公开(公告)号：US5204025A

公开(公告)日：1993-04-20

申请号：US681899

申请日：1991-04-08

申请人： Kimiko Yamada ,  Katuyosi Yada ,  Hiromu Inoue ,  Yousui Nemoto

发明人： Kimiko Yamada ,  Katuyosi Yada ,  Hiromu Inoue ,  Yousui Nemoto

IPC分类号： C08G59/00 ,  C08G59/28 ,  C08G59/32 ,  C08K3/08 ,  C08L63/00 ,  H01B1/22 ,  H05K1/09 ,  H05K9/00

CPC分类号： H05K1/095 ,  C08G59/28 ,  C08G59/3227 ,  C08K3/08 ,  C08L63/00 ,  H01B1/22

摘要： A conductive paste composition is described, which comprises an epoxy resin having a diglycidylamino group, a resol type phenol curing agent, and copper powder. The paste composition exhibits excellent moisture resistance and adhesion and provides a cured film of high conductivity level.

摘要翻译： 描述了一种导电糊剂组合物，其包含具有二缩水甘油氨基的环氧树脂，甲阶酚醛型酚固化剂和铜粉。 糊剂组合物表现出优异的耐湿性和粘合性，并提供高导电率的固化膜。

公开(公告)号：US4921623A

公开(公告)日：1990-05-01

申请号：US222532

申请日：1988-07-21

申请人： Shoji Yamaguchi ,  Kimiko Yamada ,  Katsuyoshi Yada ,  Koichi Sakaguchi ,  Hiromu Inoue

发明人： Shoji Yamaguchi ,  Kimiko Yamada ,  Katsuyoshi Yada ,  Koichi Sakaguchi ,  Hiromu Inoue

IPC分类号： C08K5/13 ,  C08K5/34 ,  C08K5/3472 ,  C08K5/3475 ,  C09D5/24 ,  C09D7/12 ,  H01B1/22 ,  H05K1/09

CPC分类号： H05K1/095 ,  C09D5/24 ,  H01B1/22

摘要： A copper-type conductive coating composition which comprises:(A) a copper powder,(B) a coating binder resin, and(C) at least one number selected from the group consisting of salicylic acid, its specific derivatives, and benzotriazolecarboxylic acid hydrazides.The copper-type conductive coating composition provides a conductive coating layer having excellent initial conductivity and capable of maintaining the level of it stable over a long period of the time.

公开(公告)号：US4705647A

公开(公告)日：1987-11-10

申请号：US878578

申请日：1986-06-26

申请人： Shoji Yamaguchi ,  Kimiko Yamada

发明人： Shoji Yamaguchi ,  Kimiko Yamada

IPC分类号： C08K5/3472 ,  C08K5/5398 ,  C09D5/24 ,  H01B1/22 ,  H01R4/04 ,  H05K1/09 ,  H05K3/32 ,  H01B1/06

CPC分类号： H01B1/22 ,  C08K5/3472 ,  C08K5/5398 ,  C09D5/24 ,  H01R4/04 ,  H05K1/095 ,  H05K3/321

摘要： A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.

公开(公告)号：US4663079A

公开(公告)日：1987-05-05

申请号：US749463

申请日：1985-06-27

申请人： Shoji Yamaguchi ,  Kimiko Yamada

发明人： Shoji Yamaguchi ,  Kimiko Yamada

IPC分类号： C08K5/3472 ,  C08K5/5398 ,  C09D5/24 ,  H01B1/22 ,  H01R4/04 ,  H05K1/09 ,  H05K3/32

CPC分类号： H01B1/22 ,  C08K5/3472 ,  C08K5/5398 ,  C09D5/24 ,  H01R4/04 ,  H05K1/095 ,  H05K3/321

摘要： A copper-type conductive coating composition which comprises:(A) a copper powder with hydrogen loss of at most 0.2% by weight or a copper powder with its oxidized surface layer removed by treatment with an organic carboxylic acid,(B) a coating binder resin, and(C) an antioxidant selected from triazoles represented by the formula: ##STR1## wherein Y is a hydroxyl group, a hydrogen atom, a C.sub.1 -C.sub.18 alkyl group or a halogen atom, and a is an integer of 1 to 3, and trithiophosphites represented by the formula: ##STR2## wherein each of R.sub.1 to R.sub.3 is a C.sub.1 -C.sub.30 alkyl group or an allyl group.

摘要翻译： 一种铜型导电涂料组合物，其包含：（A）氢损失最多为0.2重量％的铜粉末或通过用有机羧酸处理除去氧化表面层的铜粉末，（B）涂料粘合剂 树脂，和（C）选自由下式表示的三唑的抗氧化剂：其中Y是羟基，氢原子，C1-C18烷基或卤素原子，和a是 1至3，和由下式表示的三硫代亚磷酸酯：其中R 1至R 3各自为C 1 -C 30烷基或烯丙基。