发明授权
- 专利标题： Method of interconnecting wiring planes
- 专利标题（中）： 互连布线方法
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申请号： US781982申请日： 1985-09-30
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公开(公告)号： US4667404A公开(公告)日： 1987-05-26
- 发明人: Arnold Reisman , Carlton M. Osburn
- 申请人： Arnold Reisman , Carlton M. Osburn
- 申请人地址： NC Research Triangle Park
- 专利权人： Microelectronics Center of North Carolina
- 当前专利权人： Microelectronics Center of North Carolina
- 当前专利权人地址： NC Research Triangle Park
- 主分类号： H01L21/3205
- IPC分类号： H01L21/3205 ; H01L21/48 ; H01L21/82 ; H01L23/52 ; H01L23/538 ; H05K1/00 ; H05K3/02
摘要：
A microelectronics apparatus and a method of fabricating customized connections between wiring planes superposed on a substrate is disclosed. A first wiring plane having multiple conductors is formed upon the substrate. An insulating layer is formed that overlies and electrically insulates the first wiring plane. A second wiring plane having multiple conductors is formed above the insulating layer by forming multiple conductors that are electrically connected to the first wiring plane with selected conductors of the first wiring plane being electrically connected to selected conductors of the second wiring plane. The connections may be modified by breaking selected ones of the electrical connections between the first and second wiring planes to customize the electrical interconnections.
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