发明授权
- 专利标题： Method and apparatus for drawing a thick film circuit
- 专利标题（中）： 用于绘制厚膜电路的方法和装置
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申请号： US817833申请日： 1985-12-16
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公开(公告)号： US4692351A公开(公告)日： 1987-09-08
- 发明人: Yukio Maeda , Shinichi Kudo , Keiji Saeki
- 申请人： Yukio Maeda , Shinichi Kudo , Keiji Saeki
- 申请人地址： JPX
- 专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人： Matsushita Electric Industrial Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX59-76008 19840416
- 主分类号： H05K3/10
- IPC分类号： H05K3/10 ; H05K3/12 ; B05D1/26 ; B05C9/02 ; F04B43/04 ; G01D15/16
摘要：
A method and apparatus for drawing a thick film circuit on a substrate (2) by discharging a paste from a paste discharge hole provided at one end of a drawing nozzle (1), the drawing nozzle (1) being located close to the substrate (2) and relatively moved with respect to the substrate (2). The discharge rate of the paste is controlled in accordance with the relatively moving speed between the drawing nozzle (1) and the substrate (2), thereby preventing variations of film thickness and line width caused by variations in the moving speed and making it possible to form a thick film circuit at a high speed and with high accuracy.
公开/授权文献
- USD343665S Golf club head 公开/授权日：1994-01-25
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