发明授权
- 专利标题： Resin-molded semiconductor device
- 专利标题（中）： 树脂模制半导体器件
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申请号： US833535申请日： 1986-02-12
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公开(公告)号： US4698660A公开(公告)日： 1987-10-06
- 发明人: Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
- 申请人： Akihiro Kubota , Tsuyoshi Aoki , Michio Ono , Rikio Sugiura
- 申请人地址： JPX Kawasaki
- 专利权人： Fujitsu Limited
- 当前专利权人： Fujitsu Limited
- 当前专利权人地址： JPX Kawasaki
- 优先权： JPX57-052061 19820330
- 主分类号： H01L23/50
- IPC分类号： H01L23/50 ; H01L23/28 ; H01L23/31 ; H01L23/495 ; H05K3/34 ; H01L23/00
摘要：
A resin-molded semiconductor package device includes a plurality of grooves which are spaced a predetermined distance from each other in the edge portions defined by the main surface and the side surfaces of the main body of a resin-molded package, which grooves correspond to a plurality of external leads. The external leads are folded, the tips of the external leads are positioned in the grooves, and the middle portions of the external leads are located above the main surface of the package so that a predetermined standoff distance is maintained between the middle portions of the external leads and the package.
公开/授权文献
- US5806322A Refrigerant recovery method 公开/授权日：1998-09-15
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