Invention Grant
- Patent Title: Arrangement for modifying electrical printed circuit boards
- Patent Title (中): 修改电气印制电路板的布置
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Application No.: US940227Application Date: 1986-12-08
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Publication No.: US4731704APublication Date: 1988-03-15
- Inventor: Anton Lochner
- Applicant: Anton Lochner
- Applicant Address: DEX Berlin and Munich
- Assignee: Siemens Aktiengesellschaft
- Current Assignee: Siemens Aktiengesellschaft
- Current Assignee Address: DEX Berlin and Munich
- Priority: DEX3432360 19840903
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/14 ; H05K3/22 ; H05K3/34 ; H05K7/06
Abstract:
The modification of existing and assembled electrical printed circuit boards is accomplished by placing additional conductors between the lead wires (4) of the electrical components (2). These conductors are in the form of a printed conductor foil (3) which is placed on the support plate (1) of the printed circuit module. The ends of the conductors on the conductor foil (3) terminate in soldering eyelets which are soldered to the protruding lead wires (4). By this means all additional electrical connections can be made at one time and without the danger of routing errors.
Public/Granted literature
- US4156446A Tote bag Public/Granted day:1979-05-29
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