发明授权
- 专利标题： Packaging construction of a plurality of feedthrough capacitors
- 专利标题（中）： 多个馈通电容器的封装结构
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申请号： US47023申请日： 1987-05-06
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公开(公告)号： US4739440A公开(公告)日： 1988-04-19
- 发明人: Yasuo Fujiki , Takeshi Tanabe , Hiromichi Sakai
- 申请人： Yasuo Fujiki , Takeshi Tanabe , Hiromichi Sakai
- 申请人地址： JPX
- 专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人： Murata Manufacturing Co., Ltd.
- 当前专利权人地址： JPX
- 优先权： JPX61-69480[U] 19860508
- 主分类号： H01G4/35
- IPC分类号： H01G4/35 ; H01G4/38 ; H05K5/06
摘要：
A plurality of feedthrough capacitor chips are received in a single casing and retained therein in such a manner that the first outer terminals thereof are connected in common to a single earth plate formed of an electrically conductive member and installed in the casing. The lower end edge of the earth plate is exposed out of the bottom surface of the casing. On the other hand, the second outer electrodes of the feedthrough capacitor chips are respectively connected to terminals which extend to the outside of the casing.
公开/授权文献
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