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发明授权
US4745470A Endoscope using a chip carrier type solid state imaging device 失效
内镜使用芯片载体型固态成像装置

Endoscope using a chip carrier type solid state imaging device
摘要：
A solid state imaging device and a substrate to which this solid state imaging device is fitted is contained in the tip part of an endoscope. Conductive parts are formed on at least one side surface of the substrate. The positions of the conductive parts, when that the conductive parts are overlapped with the solid state imaging device, are retreated to be within the electrode positions of the solid state imaging device so that the imaging device may be contained in a small space.
摘要（中）：

固体摄像装置和固体摄像装置所搭载的基板被包含在内窥镜的前端部。 导电部件形成在基板的至少一个侧表面上。 当导电部件与固态成像装置重叠时，导电部件的位置被退回到固态成像装置的电极位置内，使得成像装置可以容纳在较小的空间中。

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