发明授权
- 专利标题： Local interconnect
- 专利标题（中）： 本地互连
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申请号： US929963申请日： 1986-11-12
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公开(公告)号： US4746219A公开(公告)日： 1988-05-24
- 发明人: Thomas C. Holloway , Thomas E. Tang , Che-Chia Wei , Roger A. Haken , David A. Bell
- 申请人： Thomas C. Holloway , Thomas E. Tang , Che-Chia Wei , Roger A. Haken , David A. Bell
- 申请人地址： TX Dallas
- 专利权人： Texas Instruments Incorporated
- 当前专利权人： Texas Instruments Incorporated
- 当前专利权人地址： TX Dallas
- 主分类号： H01L21/768
- IPC分类号： H01L21/768 ; H01L21/8244 ; H01L23/532 ; H01L23/48 ; B44C1/22 ; H01L21/306 ; H01L29/46
摘要：
A local interconnect system for VLSI integrated circuits. After titanium is deposited for self-aligned silicidation of exposed moat and gate regions in a nitrogen atmosphere, a hardmask is deposited and patterned over the titanium. When a conductive titanium nitride layer is formed overall, it will already be patterned according to this hardmask.
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